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| NS引线焊接机解决方案 | |||||
作者：NS 文章来源：本站 点击数： 更新时间：2007-3-19  |
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 Wire bonders attach a piece of semiconductor die onto its plastic or ceramic packaging. This is a very precision operation where, the package and die must line up to ensure a good electrical contact. Using an image sensor to correctly position the die, the information from the sensor is sent along the LVDS channel to a DSP. The DSP then sends the information to a die positioning table to line up the die and packaging. National offers a variety of precision operational amplifiers and DACs to handle this task. In addition power management, temperature sensors and operator display ensures that this task operates safely and efficiently. Component Highlights *LVDS - high toggle rates allow serialization of large amounts of parallel data for efficient transmission over a single 100 ohm transmission line, with reduced emissions and drastically improved immunity to external interference. *Operational amplifiers - Rail-to-rail input and output amplifiers maximize the signal range. *D/A converter - with high resolution and sampling rates, DACs easily interface with microprocessors and TTL logic. *Ethernet - Ethernet devices consume low power and are available in a wide range of speeds from 10/100 MB/s to 1Gbps 1 Power LP2997 LP38691 LP38693 2 LVDS DS92LV1021A DS92LV1023E DS92LV1260 3 Display ADCS9888CVH-170 ADCS9888CVH-140 4 DAC DAC081S101CIMK DAC081S101CIMKX DAC081S101CIMM 5 Amp LMH6639 LMH6642 LMH6643 6 Ethernet DP83816AVNG 7 Temp Sensor LM26 LM27 8 Power LM25005 LM25007 LM25010 |
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