|
|||||||||
 |
|
||||||||
|
|
||||||||||||||
| . 网站首页 . 新闻 . 新品 . 方案 . 专访 . 活动 . DSP . EDA . 评测室 . 技术文库 . 会员区 . 商城 . 服务导航 . 邮购 . 资源 . | ||
 |
||
|
||
|
|||||
| NEC 3G手机解决方案 | |||||
作者：NEC 文章来源：本站 点击数： 更新时间：2007-3-18  |
|||||
|
预计第三代手机将受到消费者的热烈欢迎，并进一步刺激换机需求。全球各地的电信公司正在准备部署3G移动通信网络。 第三代手机具有新一代业务功能，它们可利用2GHz的高频波段所具备的高传输效率，提供带宽达到2Mbps的高速通信服务。这种带宽可以满足多媒体通信（譬如动画传送）的需要，一个典型的例子就是在手机上观看电视。这将彻底改变手机的应用方式。 为了实现3G商用，手机必须经过一系列技术改进。这些挑战包括在保持高速通信、高性能信号处理和提供很高的内存容量（用于多媒体处理）的同时，降低终端的功耗。作为半导体厂商，我们需要迎接这些挑战，提供最佳的解决方案。 3rd generation mobile phone Mobile phone (mobile communication) use has undergone the changes shown below. 1st generation mobile phone (1G): Used mainly as a car phone service and was provided using analog technology. 2nd generation mobile phone (2G): Used digital technology (GSM, PDC, TDMA). Other services such as the i-mode in Japan, GPRS in Europe, service followed, and were referred to as 2.5 generation (2.5G). 3rd generation mobile phone (3G): Uses high-speed communication and the highly efficient W-CDMA technology. The first 3G service in Japan was NTT DoCoMos FOMA, which started in October 2001. The current transmission speed is 348 kilobits/second and its ultimate goal is 2 megabits/second.  High-end mobile terminals have performance capabilities equivalent to 10-year-old PCs. They require high-speed signal processing, advanced image processing, and high-density memory mounting technology. To meet these demanding requirements, NEC Electronics will use the following three approaches. (1) NEC Electronics supplies two types of CPU: one for performing communication processing (digital base band) and another for processing sophisticated applications such as GPS and sound sources for termination sound, with striking improvements in quality. (2) In 3rd generation mobile phones, LCD (liquid crystal display) components are shrinking rapidly, and more multi-paneled products are expected to appear. NEC Electronics is therefore offering LCD driver/controllers for the smooth operation of color TFT and large panels. (3) In order to perform the processing described above, a number of high capacity memory types are required. At the same time, only a limited amount of space is available inside the mobile phone and the physical memory size must be kept as small as possible. To satisfy these contradictory requirements, high-density memory and custom IC mounting are used. A package solution will be provided that places everything into a single package using system in package (SIP) technology. NEC Electronics will also provide various devices types that can be used with conventional 2nd generation mobile terminals. Please see the following block diagram.   •Up to 64 sounds could be simultaneously produced with built-in surround function. (PRESS)NEC Electronics Announces New Sound Synthesizer LSI Solution for Cell Phones,Sep.15,2003 (PRESS)NEC Electronics Unveils Industrys Smallest and Thinnest Leadless Packages for Small Signal Discrete Devices •Supported both Autonomous method and MS method and realized a compact and energy saving type. (PRESS)NEC Electronics Develops GPS Chipset for Mobile Applications with Three-mode Positioning System,Jul.4,2003 •Reduced blinking on crystal liquid display screen and improved gradation display. (PRESS)NEC Electronics Acquires Licenses for LCD Driver Patents from Honeywell,Apr.8,2003 •Promoted dissemination of interfaces developed by NEC Electronics. (PRESS)MediaQ Supports NEC Electronics Low-power, High-speed Mobile Display Interface,Feb.03,2003  Digital baseband Cell base IC CB-130 Series Purchasing or developing the base-band section LSI requires prior licensing agreement between licenser and you, a customer. Contact with our sales staffs in our company for detailed information. Applications GPS:µPD77533, µPD77538 Ringer tone(tone source): µPD9990 Camera (MPEG4 dynamic image processing):Being developed Memory Low-power SRAM µPD448012 µPD444012A µPD442000A,442012A,442002 µPD431000A,441000L µPD43256B,43257B Mobile Specified RAM µPD46128312 µPD4664312 µPD4632312A µPD4616112 Flash memory µPD29F064115 µPD29F032202AL,29F032203AL,29F032204AL LCD driver TFT source driver IC (w/o built-in RAM) µPD161600 µPD161602A TFT source driver IC (with built-in RAM) µPD161620 µPD161621A µPD161622 µPD161623 TFT source driver IC µPD161640 µPD161641 µPD161643 µPD161644 TFT power IC µPD161660 µPD161661 Package MCP/SiP development status in our company (or in NEC Electronics) LCD driver source driver IC (w/o built-in RAM) µPD161600 µPD161602A TFT source driver IC (with built-in RAM) µPD161620 µPD161621A µPD161622 µPD161623 TFT gate driver IC µPD161640 µPD161641 µPD161643 µPD161644 TFT power IC µPD161660 µPD161661 |
|||||
| 欢迎点击进入：TI德州中文网 (国内唯一针对TI应用的中文技术网站) 文章录入：admin 责任编辑：admin | |||||
| 【发表评论】【加入收藏】【告诉好友】【打印此文】【关闭窗口】 | |||||
| 最新热点 | 最新推荐 | 相关文章 | ||
| 没有相关文章 |
| 网友评论：（只显示最新10条。评论内容只代表网友观点，与本站立场无关！） |
| | 设为首页 | 加入收藏 | 联系站长 | 友情链接 | 版权申明 | 网站公告 | 管理登录 | | |||
|
